Benqiang Circuit has successfully developed a 4-layer ultra-thin 0.25mm and high-density HDI PCB. This ultra-thin and high-density HDI multilayer board is made of general FR4 resin system board, semi cured sheet, and electrolytic copper foil lamination. The control difficulties in ultra-thin core board lamination, mechanical burying, laser drilling, and ultra process capable core board production are all difficult. The production and processing are prone to a series of problems such as board deformation, uncontrolled thickness, and large interlayer deviation.

The PCB board process has been successful. This product is a 4-layer PCB step board, designed as a 16 matrix RF board. To meet the requirements of RF signal and space utilization, the L1-L2 large copper skin position needs to be opened for step gongs to expose the inner circuit and plug-in holes of the L3 layer. However, common step production schemes cannot meet this requirement.

High frequency circuit board refers to a special type of circuit board with high electromagnetic frequency, which has a low dielectric constant and low loss. It is used for PCBs in the fields of high frequency (frequency greater than 300MHz or wavelength less than 1 meter) and microwave (frequency greater than 3GHz or wavelength less than 0.1 meter), and is commonly used in fields such as automotive collision prevention systems, satellite systems, and radio systems.

Benqiang Circuit estimates that in the future, ordinary 5G smartphones will require at least 8-12 layers of 4th order HDI motherboards, while the technology of high-end flagship phones will be directly upgraded to any layer of HDI (Anylayer HDI) above the 14th layer and 5th order, which has surpassed the current level of most domestic private enterprises

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