Benqiang Circuit has successfully developed a 4-layer ultra-thin 0.25mm and high-density HDI PCB. This ultra-thin and high-density HDI multilayer board is made of general FR4 resin system board, semi cured sheet, and electrolytic copper foil lamination. The control difficulties in ultra-thin core board lamination, mechanical burying, laser drilling, and ultra process capable core board production are all difficult. The production and processing are prone to a series of problems such as board deformation, uncontrolled thickness, and large interlayer deviation.
NEWS
2023-07-13